Category Archives: Question & Answers
Seeing ElectroStatic Discharge (ESD) damage is basically impossible. Damage to semiconductor device structure is NOT visible at ordinary magnifications of an optical microscope. If the microscope is capable of 1000X-1500X magnifications, you just might be able to “see” something. The method used, only occasionally as there is considerable expense, is by delayering and etch enhancement producing high magnification photographs using a scanning electron micrograph (SEM). See Images of ESD Damage, photos of Human Body Model (HBM) ESD damage provided by Hi-Rel Laboratories, Inc. at 6116 N Freya, Spokane, Washington 99217 (509-325-5800 or www.hrlabs.com). Used with their permission.
To have an ESD control programme conform to EN 61340-5-1 does the programme have to use all the ESD protected area ESD control items listed in Table 3? These are: working surfaces, storage racks, trolleys, flooring, ionization, seating, and garments.
No, you can decide which ESD control items to use.
Per EN 61340-5-1 clause 5.2.1 “ESD control program plan, The organization shall prepare an ESD control program plan that addresses each of the requirements of the program. Those requirements concern:
- compliance verification,
- grounding/bonding systems,
- personnel grounding,
- EPA requirements,
- packaging systems,
Each company has flexibility designing its programme as EN 61340-5-1 Introduction states: “Each company has different processes, and so will require a different blend of ESD prevention measures for an optimum ESD control program. It is vital that these measures are selected, based on technical necessity and carefully documented in an ESD control program plan, so that all concerned can be sure of the program requirements.”
The ESD control programme plan is to be written. We recommend starting by reviewing Annex A of User guide CLC/TR 61340-5-2:2008 “Example ESD Control Document based on IEC 61340-5-1”. It notes “The following document demonstrates the flow and required sections for an ESD control program as defined by IEC 61340-5-1. This program is based on one of the most basic ESD programs that can be implemented. In most cases, an actual ESD program will utilize more ESD control elements. Personnel are grounded by a wrist strap. Handling operations are performed at a grounded worksurface and ESD sensitive devices are moved from operation to operation inside a metallized shielding bag.”
To ask an ESD Question Click Here
What happens if you staple ESD Bags shut? Does that damage the ESD Bag’s effectiveness? What if the ESD Bag is heat sealed shut & a staple on the seam is used to attach paperwork?
Vermason ESD Shielding Bags have a layer of metalized film which creates continuous conductive enclosure or Faraday Cage to provide electrostatic shielding protecting the ESD sensitive devices placed inside the Bag. The use of stapling to close ESD Bags is counter productive and not recommended. The metal staple provides a conductive path from the outside of the ESD Bag to the inside. The use of a metal staple would undermine the effectiveness of the ESD Bag making a conductive path for charges outside the Bag to charge outside the Bag to charge or discharge to ESD sensitive components inside the Bag.
To close the ESD Bag, it is recommended to heat seal, or use Vermason ESD Labels after the opening of the bag has been folded over.
To view Vermason ESD Labels Click Here
Or to view Vermason Antistatic Tape Click Here
Carefully locating the staple to only the seam of the Vermason Statshield® Bag would theoretically make it part of the “continuous conductive enclosure” and be acceptable. However, we are not aware of any end user using this method and cannot recommend it. The staple would be an exposed conductor that could charge or discharge to ESD sensitive devices.
To ask an ESD Question Click Here.